NEWS | Moulded Interconnect Devices
A Moulded Interconnect Device can be defined as a substrate(Often injection moulded) which incorporates a conductive pattern and combines mechanical and electrical functionality. MID processes nowadays typically consist of three process steps: moulding, metallization and patterning. Surface as well as volume MID’s can be distinguished.
• Complex moulded objects with integrated 3D electrical circuit
• New “un-thinkable” design possibilities
• 3D electronic objects produced very cost effective
MID technology combines the benefit of a large degree of freedom (due to injection moulding) with a high level of electrical function integration The advantages of MID technology are the reduction in assembly, miniaturization and more robust products due to the lack of separate connections. MID technology can be used in a variety of products and markets(automotive, consumer electronics, high-end equipment).
In order to achieve the prospect optimal solution to your problem, KeyTec produces this kind of products in close cooperation with TNO Technology Center.
|© 2012, KeyTec | sitemap | colofon | disclaimer | | | | | | | | | ||